Telangana media delegation visits India’s first indigenous semiconductor assembly facility in Assam

A media delegation from Telangana on Wednesday visited the Tata Semiconductor Assembly and Test Pvt. Ltd. (TSAT) facility in Jagiroad, Assam India’s first fully indigenous semiconductor assembly and testing unit designed to cater to both domestic and global markets. The visit highlighted a major leap in India’s efforts to build a self-reliant semiconductor ecosystem under the India Semiconductor Mission.

Shri Ashish Mishra, Project Head of TSAT, briefed the delegation on the scale and significance of the project. Developed with an investment of ₹27,000 crore, the facility is owned and operated by Tata Electronics, marking one of the largest semiconductor-related manufacturing commitments made in India to date. Once operational, the plant is expected to achieve a production capacity of up to 48 million semiconductor chips per day, significantly boosting the country’s advanced electronics manufacturing capabilities.

Mishra said the project will generate over 27,000 direct and indirect jobs, contributing to economic growth in Assam and positioning the Northeast as an emerging player in India’s semiconductor landscape.

The TSAT unit focuses on three core semiconductor assembly and packaging technologies: Wire Bond, Flip Chip, and an advanced Integrated Systems Packaging (ISP) solution. These processes form a crucial part of the semiconductor value chain, where delicate silicon wafers manufactured at global or domestic fabs are cut, assembled, packaged, and rigorously tested before being integrated into electronic devices.

Wire Bonding is widely used for traditional chip packaging, while Flip Chip technology enables higher speed, smaller form factor, and better heat management. The ISP platform, a differentiated offering by Tata, supports high-density, high-performance chips essential for next-generation applications.

Mishra noted that the roadmap includes scaling into even more sophisticated packaging capabilities, vital for sectors such as electric vehicles, high-speed communications, artificial intelligence hardware, and advanced network infrastructure.

Semiconductor assembly and testing are among the most critical and value-added stages in chip manufacturing. Innovations in this segment help improve performance, reduce size, increase reliability, and lower production costs making it pivotal for India’s competitiveness in the global semiconductor supply chain.

The TSAT facility is being developed under the Government of India’s comprehensive semiconductor policy, driven by the India Semiconductor Mission, with additional support from the Government of Assam’s Electronics Policy. Together, these initiatives aim to position India as a globally competitive hub for semiconductor manufacturing, packaging, and research.